INFORMS Open Forum

Call for Papers, Senior Design Posters, and PBL Posters
11th North American IEOM Industrial Engineering and Operations Management Conference
Milwaukee, Wisconsin, USA, June 8–11, 2026

We invite students, researchers, and professionals to participate in the 11th North American IEOM Conference. This is an excellent opportunity to present your work, network with global peers, and publish in indexed conference proceedings.

 Presentation Opportunities

• Senior Design Projects (Poster, Abstract, or Full Paper)
• Project-Based Learning (PBL) Posters
• Course Project Posters (if relevant to IEOM topics)
• Research Papers & Abstracts

 Publication & Indexing

Accepted submissions will be included in:

• Conference Proceedings with ISBN & ISSN
• DOI via CrossRef
• Open Access
• Indexed publications

 Conference Format

• Onsite + Virtual (Zoom participation available)

 Important Deadline

- Submission Deadline (Extended): April 15, 2026

 Global Participation

Expected participation from 35+ countries with over 300 submissions, including:
Afghanistan, Algeria, Australia, Bangladesh, Bolivia, Botswana, Brazil, Canada, Chile, China, Colombia, Costa Rica, France, Germany, India, Indonesia, Japan, Kuwait, Malaysia, Mexico, Nigeria, Norway, Oman, Panama, Peru, Portugal, Saudi Arabia, South Africa, Taiwan, Thailand, United Kingdom, United States, Vietnam, and more.

 Why Participate?

• Present your work to an international audience
• Publish in indexed proceedings
• Build academic and industry collaborations
• Network with researchers, faculty, and industry professionals

Whether you submit a paper or simply attend, this conference offers valuable opportunities for learning, collaboration, and professional growth.

 Submit your work or plan to attend today!

11th North American International Conference on Industrial Engineering & Operations Management

Templates

• Paper Template
• Abstract Template
• Poster Template

Travels and Transportation

Milwaukee General Mitchell International Airport (MKE)

The Milwaukee General Mitchell International Airport (MKE) is the closest airport to the UWM campus. For ease of transportation, we recommend you fly into MKE if possible.

MKE is well connected to major U.S. hubs such as Chicago (ORD), Detroit (DTW), Atlanta (ATL), Dallas (DFW), and New York (JFK/LGA). 

From Chicago O'Hare International Airport

(approximately 90 minutes from Milwaukee by train, bus or car)

• Use CoachUSA from the Chicago Airport for Milwaukee (Preferred)
• CoachUSA Bus Service
  • Take a CoachUSA bus from O'Hare to Milwaukee General International Airport. Be sure to double-check the CoachUSA bus schedule. The bus does not have 24/7 service.
  • Purchase a ticket in advance (before you travel) and print your ticket.
  • The Coach USA bus station at the Chicago O'Hare International Airport is located at the Multi-Modal Facility (MMF) at 10255 W. Zemke Boulevard. The MMF is accessible from each terminal via the Airport Transit System.
  • Pay attention to the CoachUSA schedule, as buses do not run late at night.

Milwaukee is also home to a diverse range of industries, providing excellent opportunities for academic–industry collaboration and engagement.

June 8^th Company visits:

• 10-12 PM: CNH, Racine Visit – Agricultural and construction equipment manufacturer
• 12-2 PM: Travel to Rockwell Automation and Lunch at the Rockwell Automation Cafeteria
• 2-4 PM: Rockwell Automation

June 12, 9-11 AM – Plant Visit

• Visit to Komatsu Mining

Keynotes

• Canan Bilen-Green, UWM Vice Provost for Faculty Affairs (Welcome Speaker)
• John Miller, Director, Wisconsin Economic Development Corporation
• Andrew Ellis, VP Global Portfolio Engineering, Rockwell Automation
• Monica L. Davis, Sr HR Leader, Delek US Holdings, Inc., Texas
• Sangapani- Missouri Institute of Science and Technology
• Keuter Tucker, Data Science Manager, Charter Steel
• Joe Hamman, Executive Director, UWM Connected Systems Institute
• Michael Cook, Director of Industry-Academia Engagement, Rockwell Automation
• John Dyck, Chief Executive Officer, CESMII, The Smart Manufacturing Institute
• Anthony Rollett, Carnegie Mellon University
• Jason House, Manager, Supply Chain Programs, Northrop Grumman, Chicago, Illinois, United States
• Alejandro Hernández González, Professor of Electrochemistry, Manufacturing Processes, and Dynamics, Faculty of Chemical Sciences, Universidad Juárez del Estado de Durango (UJED), Durango, Mexico
• Mohammad Habib Rahman, Richard and Joanne Grigg Professorship, Professor and Department Chair, Mechanical Engineering, Affiliate Professor, Computer Science and Biomedical Engineering, Switzer Research Distinguished Fellow, and Director, Biorobotics Lab, University of Wisconsin-Milwaukee

Keynote Panels

• Industry Panel on Workforce Development
• Milwaukee Area Community College AI and Automation programs

Panels

1. Continuous Improvement Panel, Chair: Girish Kumar Gopalakrishnan, MS, CMBB, CSSBB, CMQ-OE, Senior Manager – Continuous Improvement – CNH
2. IEOM Curriculum and AI Panel: Chair: Dr. Luis Rabelo, Professor, Department of Industrial Engineering & Management Systems, University of Central Florida, Orlando, FL, USA
3. Supply Chain Management Panel, Chair: Senthilkumar Thiyagarajan, Sr Analyst Supply Chain, Inventory Management, Medline Industries, LP
4. Women in Industry and Academia (WIIA) Panel, Panel Chair: Dr. E. Shirl Donaldson, PMP, Faculty Member, College of Innovation and Technology, University of Michigan Flint
5. Entrepreneurship Mindset Panel, Panel Chairs: Prof. Don Reimer, COO-IEOM and Heidi Morano, Director, Entrepreneurial Engineering Design Curriculum, College of Engineering, Lawrence Technological University, Southfield, Michigan
6. Advanced Manufacturing Panel

Tracks

1. Artificial Intelligence and Data Science
2. Automation, Robotics and Autonomous Systems
3. Business Management and Operations Management
4. Digital Manufacturing, Industry 4.0 and IoT
5. Engineering Education and Curriculum Improvement
6. Engineering Management and Project Management
7. Entrepreneurship and Innovation
8. Facility Planning and Layout
9. Human Factors, Ergonomics and Healthcare System Management
10. Lean Six Sigma and Operations Excellence
11. Manufacturing, Assembly and Design
12. Quality, Reliability and Maintenance
13. Simulation, Optimization and Productivity Improvement
14. Supply Chain and Logistics
15. Sustainability, Green Systems and Energy
16. Case Studies and Best Practices

Competitions

1. Undergraduate Student Paper CompetitionSponsored by SIEMENS
2. Graduate Student Paper CompetitionSponsored by EATON Corporation
3. Master Thesis Competition
4. Doctoral Dissertation Competitionsponsored by Airbus
5. Senior Capstone Design Project Competition
6. Undergraduate Research Competitionsponsored by Daikin Applied
7. High School STEM Competition
8. Lean Six Sigma Competition
9. Simulation Competition
10. Supply Chain and Logistics Competitionsponsored by aThingz
11. PosterCompetition
12. AI & ML Competition
13. Human Factors and Ergonomics Competition
14. Global Design Competitionsponsored by Amatrol Inc.

Publication & Indexing

• Accepted full papers will be published in the IEOM Conference Proceedings, open access, with a DOI via CrossRef.
• Proceedings carry ISSN: 2169-8767 (U.S.) and ISBN.
• Papers will be considered for indexing in databases including CrossRef, Google Scholar, IEOM Index, EBSCO, and potentially the Web of Science Conference Proceedings Citation Index (CPCI) - though indexing is not guaranteed.
• Each accepted full paper undergoes a double-peer review process.

• Wilkistar Otieno (UWM) – Chairperson, otieno@uwm.edu
• Satya Aditya Akundi (UWM), akundivy@uwm.edu
• Luis Rabelo (University of Central Florida)
• Ahad Ali (Lawrence Technological University)

Program Chairs:

• Don Reimer (COO, IEOM)
• Mohammad Habib Rahman (UWM)

Industry Chairs

• E Shirl Donaldson, College of Innovation and Technology, University of Michigan Flint

Technical Chairs

• Girish Gopalakrishnan, Senior Manager Continuous Improvement – North America, CNH, Milwaukee, USA
• Dr Senthilkumar Thiyagarajan, Sr Analyst Supply Chain, Inventory Management, Medline Industries, LP

Attendance Certificates will be provided for conference participants. Continuous Education Unit (CEU) is available. IEOM Society International will provide some awards and recognition.

Proceedings of the IEOM North American Conferences - https://index.ieomsociety.org/

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